主板参数组

• 型号 H11DSi-NT
• 品牌 SUPERMICR
• 外形 E-ATX
• 尺寸 30.5cm x 33.1cm
• 支持的CPU Dual AMD EPYC™ 7001/7002* series Processors (*Board revision 2.x required) Socket SP3 Up to 240W TDP
• 核心 Up to 32 Cores Up to 64 Cores (Board revision 2.x required)
• 内存容量 16 DIMM sockets Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.x required) 8-channel memory bus
• 内存类型 DDR4 2666 MHz Registered ECC, 288-pin gold-plated DIMMs DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs (Board revision 2.x required)
• DIMM尺寸 8GB, 16GB, 32GB, 64GB, 128GB, 256GB* (*Board revision 2.x required)
• 内存电压 1.2V
• 错误检测 Corrects single-bit errors Detects double-bit errors (using ECC memory)
• 芯片组
• SATA 10 SATA3 (6 Gbps) ports
• 音频
• IPMI Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support ASPEED AST2500 BMC
• 网络控制器 Intel® X550 10G Base-T Ethernet Controller 1 Realtek RTL8211E PHY (dedicated IPMI)
• 局域网 2 RJ45 10GBase-T ports 1 RJ45 Dedicated IPMI LAN port
• USB 2 USB 3.0 ports (rear) 4 USB 2.0 ports (2 rear + 2 via header)
• 视频输出 1 VGA port
• 串行端口/接头
• TPM
• PCI-E 3 PCI-E 3.0 x8 2 PCI-E 3.0 x16
• M.2 Interface: 1 SATA/PCI-E 3.0 x2 (Platform with EPYC 7002 processor only supports PCI-E type M.2 module) Form factor: 2280, 22110 Key: M-key
• BIOS类型 AMI 128Mb SPI Flash EEPROM
• BIOS功能 Plug and Play (PnP) DMI 2.3 PCI 2.2 ACPI 5.1 USB Keyboard Support SMBIOS 3.1.1
• 软件
• 系统管理软件
• Hardware
• 电源配置 ACPI Power Management Power-on mode control for AC power loss recovery
• 电压
• FAN Up to 8-fan status tachometer monitoring Up to eight 4-pin fan headers Dual Cooling Zone Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
• 温度 Monitoring for CPU and chassis environment CPU Thermal Trip Support Thermal control for 8x Fan connectors I2C Temperature Sensing Logic
• LED CPU / System Overheat LED
• 其他功能 Chassis Intrusion Detection Chassis Intrusion Header UID
• 工作温度范围 10°C to 35°C (50°F to 95°F)
• 非操作温度范围 -40°C to 70°C (-40°F to 158°F)
• 工作相对湿度范围 8%到90%(非冷凝)
• 非工作相对温度范围 5%至95%(非冷凝)